Products - Semiconductors

Go Back

SiO2 Slurry
  1. Homogeneous dispersion to provide quality requirements to your application. Excellent lifetime, no scratching, uniform surface finish (Ra) in comparison with the other sources.
  2. The particle size distribution is uniform, and the shape is spherical. Easy to clean, non-crystalline residue.
  3. High purity can diminish impurity on products.
  4. Non-toxic, no environmental hormones nor solvent containing no VOC and other environmental issues.
  5. Application to semiconductor, optoelectronic semiconductor materials, such as silicon, silicon carbide wafer, sapphire wafer, gallium arsenide wafer, gallium nitride wafers, precision optics.
  6. We could customize products by your need
Laser dicing solution

在雷射切割加工前,塗佈在加工物表面上,可大幅抑制加工過程產生異物黏附,提升加工物表面精準性。且其設計方向為水溶性,藥劑濕潤分散性良好,增加易於塗佈性能,與加工完之清洗性。可防止切割過熱,灼傷玻璃基板或藍寶石基板。為高濃度產品,使用上頗具經濟性。